The Heart of Our Technology

SC-350 process chamber

The core of the SC-350 is a versatile process chamber designed for both established standard applications such as vacuum reflow soldering and future innovative processes. It is equipped with a powerful automation platform and uses a forward-looking software architecture that supports smart manufacturing and IoT applications.

  • Precise control of process parameters
  • Ideal for high-volume production and flexible adjustments
  • Unlimited functionality
  • Maximum flexibility for research, development, and mass production
  • IoT connectivity
  • Worldwide support with minimal operating costs and certified IT security

The SC Series: The Smart Processing Core

With the SC series, REK Innovation presents a new generation of intelligent process chambers that combine research flexibility with the performance and reliability required for continuous operation.

  • Working area: 400 × 350 × 70 mm
  • Maximum temperature: up to 1000°C
  • Vacuum capability: high-vacuum processes for maximum purity
  • Gas processing: adjustable atmospheres for inert and reactive gases (including formic acid for flux-free soldering)
SC series illustration

Intelligent Process Control for Maximum Efficiency

SC-350 in action

The SC-350 supports both contact-based and contactless heat transfer, enabling a wide range of applications such as processing power electronics on DBC or AMB substrates.

  • Independent heating and cooling control – extremely fast temperature changes
  • Highest efficiency – short cycle times for maximum productivity

Applications

Vacuum reflow ovens are primarily used for applications where void-free soldering is essential:

  • Power electronics (DBC / AMB)
  • LED manufacturing
  • Die attach & wafer-level packaging
  • Substrate soldering & package sealing
  • Other thermal processes such as annealing, sintering, and alloying

Technological Highlights

  • Control accuracy: ±0.5 K throughout the entire process
  • Temperature uniformity: 1% homogeneity across the full process area of 450 × 350 mm – including heating and cooling phases
  • State-of-the-art control system: Industry 4.0 capable platform with secure remote access and long-term availability
  • Flexible heat transfer: Direct or indirect heating of your products – optimally adaptable to material, process, and thermal requirements
  • Optimized for all soldering processes: Ideal for processing flux-free and flux-containing solders

Technical Data

  • Dimensions (W × D × H): 790 × 1420 × 1230 mm
  • Weight: approx. 230 kg
  • Maximum process temperature: 1000 °C
  • Process chamber: 450 × 350 × 75–150 mm (width × length × height)
  • Suitable for: power modules, T/R modules, power LEDs, laser bars, MEMS, flip‑chip processes
  • Example loading: 300 mm wafer
  • Temperature performance: control accuracy ±0.5 K
  • Temperature uniformity: 1% homogeneity across the entire process area
  • Process atmosphere & pressure range:
    • • Supported atmospheres: formic acid, inert gases, forming gas (≤ 5% H₂), hydrogen
    • Pressure range: from 1 bar overpressure through atmospheric pressure down to high vacuum 5 × 10⁻⁶ mbar
    • In‑situ monitoring of residual oxygen throughout the entire process

Contact

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